Testing Interface Thermal Resistance

  title={Testing Interface Thermal Resistance},
  author={M{\'a}rta Rencz},
  journal={2007 9th Electronics Packaging Technology Conference},
  • Márta Rencz
  • Published 2007 in
    2007 9th Electronics Packaging Technology…
The paper presents some recent trends in TIM material development, and outlines the state of the art in testing interface thermal resistance values. After presenting the trends in TIM material development first the available experimental techniques are presented shortly, and then the currently available industrial methods are discussed with more details. The paper finally presents some promising developments in finding better resolution high throughput methods to solve the challenging problem… CONTINUE READING