Temperature control of electromigration to form gold nanogap junctions
@article{Esen2005TemperatureCO, title={Temperature control of electromigration to form gold nanogap junctions}, author={G. Esen and Michael S. Fuhrer}, journal={Applied Physics Letters}, year={2005}, volume={87}, pages={263101} }
Controlled electromigration of gold nanowires of different cross-sectional areas to form nanogap junctions is studied using a feedback method. A linear correlation between the cross-sectional area of the gold nanowires and the power dissipated in the junction during electromigration is observed, indicating that the feedback mechanism operates primarily by controlling the temperature of the junction during electromigration. We also show that the role of the external feedback circuit is to…
114 Citations
Conductance of gold nanojunctions thinned by electromigration
- Physics
- 2008
We investigate nanocontact formation by thermally assisted electromigration of gold nanowires. An automatic cycling process allows us to follow a line of constant power dissipated at the nanocontact…
Controlled fabrication of 1–2nm nanogaps by electromigration in gold and gold-palladium nanowires
- Physics
- 2007
The authors report the electrical characterization of gold and gold-palladium nanowires failed by electromigration. Nanogaps 1–2nm in size are reliably made from metal nanowires by controlling the…
Fabrication of nanogaps by a progressive electromigration technique using wires of various thicknesses
- Materials Science
- 2011
The authors report the fabrication of nanogaps formed by electromigration from gold wires of various widths (25–80 nm). This technique is a reliable and consistent method to create quality gaps…
The role of Joule heating in the formation of nanogaps by electromigration
- Physics
- 2006
We investigate the formation of nanogaps in gold wires due to electromigration. We show that the breaking process will not start until a local temperature of typically 400K is reached by Joule…
Feedback controlled electromigration in four-terminal nanojunctions
- Engineering
- 2007
The authors have developed a fast, yet highly reproducible method to fabricate metallic electrodes with nanometer separation using electromigration (EM). They employ four terminal instead of…
Structure and local charging of electromigrated Au nanocontacts.
- Materials ScienceNanotechnology
- 2017
We study the structure and the electronic properties of Au nanocontacts created by controlled electromigration of thin film devices, a method frequently used to contact molecules. In contrast to…
Feedback-controlled electromigration for the fabrication of point contacts
- Physics
- 2013
Lithographically fabricated point contacts serve as important examples of mesoscopic conductors, as electrodes for molecular electronics, and as ultra-sensitive transducers for mechanical motion. We…
Memory Effect in Simple Cu Nanogap Junction
- Physics
- 2010
We have investigated the resistance switching effect in Cu nanogap junction. Nanogap structures were created by means of electromigration and their electrical properties were measured in a high…
Local Joule heating in electromigrated Au nanowires imaged by in situ atomic force microscopy
- Physics2017 IEEE 12th Nanotechnology Materials and Devices Conference (NMDC)
- 2017
Quantitative studies of Joule heating and mass transport in electromigration (EM) are essential for reproducible fabrication of electrodes with nanoscale gaps in metal nanowires. In this work,…
Control of channel resistance on metal nanowires by electromigration patterning method
- Physics
- 2009
A simple method for fabricating nanoscale gaps between metal electrodes, based on the break of metal nanowires induced by electromigration of metal atoms, was investigated to control the channel…
References
SHOWING 1-10 OF 10 REFERENCES
Controlled fabrication of nanogaps in ambient environment for molecular electronics
- Physics
- 2005
We have developed a controlled and highly reproducible method of making nanometer-spaced electrodes using electromigration in ambient lab conditions. This advance will make feasible single molecule…
Fabrication of metallic electrodes with nanometer separation by electromigration
- Physics
- 1999
A simple yet highly reproducible method to fabricate metallic electrodes with nanometer separation is presented. The fabrication is achieved by passing a large electrical current through a gold…
Kondo effect in electromigrated gold break junctions.
- PhysicsNano letters
- 2005
Gate-dependent transport measurements of Kondo impurities in bare gold break junctions are presented, generated with high yield using an electromigration process that is actively controlled and consistent with theoretical predictions for g = 2.
Electromigration in thin film conductors
- Engineering
- 1997
The state of the art in understanding of electromigration induced failure is outlined in the following review. An overview of the basic principles responsible for electromigration in conductors is…
Fabrication and characterization of sub-3 nm gaps for single-cluster and single-molecule experiments
- Physics
- 2003
We describe a simple process for preparing sub-3 nm gaps by means of controllable breaking of gold wires lithographed on a SiO2/Si substrate at low temperature (4.2 K). We show that the mechanism…
Nanomechanical oscillations in a single-C60 transistor
- Physics, ChemistryNature
- 2000
Transport measurements are performed that provide evidence for a coupling between the centre-of-mass motion of the C60 molecules and single-electron hopping—a conduction mechanism that has not been observed previously in quantum dot studies.
Electromigration failure modes in aluminum metallization for semiconductor devices
- Physics
- 1969
Two wear-out type failure modes involving aluminum metallization for semiconductor devices are described. Both modes involve mass transport by momentum exchange between conducting electrons and metal…
3ω method for specific heat and thermal conductivity measurements
- Physics, Engineering
- 2001
We present a 3ω method for simultaneously measuring the specific heat and thermal conductivity of a rod- or filament-like specimen using a way similar to a four-probe resistance measurement. The…
Failure mechanism models for electromigration
- Engineering
- 1994
This tutorial illustrates situations where electromigration (a wearout failure mechanism) in electronic devices can degrade performance and how solid-state electromigration failure can be avoided.
An Introduction to Heat Transfer
- Physics, Engineering
- 1950
The importance of heat transfer in food processing is obvious; the changes in food safety and palatability on heating are so marked that many food processes are built around heat transfer. The…