Temperature Cycling for Photoresist Processing

Abstract

A programmable multizone thermal processing module together with a model-based feedback control method are developed to achieve temperature uniformity of a silicon wafer throughout the processing temperature cycle of ramp, hold and quench in post-exposure bake (PEB) step of lithography. The module comprises of numerous small thermoelectric devices (TEDs… (More)

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Cite this paper

@inproceedings{Wang2008TemperatureCF, title={Temperature Cycling for Photoresist Processing}, author={Yuheng Wang and HuiTong Chua and Arthur Tay and Zhongping Fang}, year={2008} }