Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits

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@article{Huang2014TemperatureAwareLA, title={Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits}, author={Shih-Hsu Huang and Hua-Hsin Yeh}, journal={IEICE Transactions}, year={2014}, volume={97-A}, pages={1699-1708} }