• DOI:10.1007/978-0-387-98120-8_2
• Corpus ID: 16344651

Technology Advances and Challenges in Hermetic Packaging for Implantable Medical Devices

@inproceedings{Jiang2009TechnologyAA,
  title={Technology Advances and Challenges in Hermetic Packaging for Implantable Medical Devices},
  author={Guangqiang Jiang and David D. Zhou},
  year={2009}
}

• G. Jiang, David D. Zhou
• Published 2009
• Engineering, Medicine

Many implantable medical devices contain sophisticated electronic cir- cuits. Hermetic packaging is required to provide the implant's electronic circuitry with protection from the harsh environment of the human body. This chapter pro- vides a review of available hermetic sealing methods and their applications. General considerations of implantable medical device packaging are discussed. Various test- ing methods applicable to the packaging of implantable medical devices are also presented. Many issues associated with hermetic packaging are not yet completely understood, nor are any corresponding difficulties completely overcome. The con- tinued miniaturization of future implantable medical devices provides both oppor- tunities and challenges for packaging/materials engineers to improve the existing packaging methods, and to develop new methods. Reliable hermetic micropackag- ing technologies are the key to a wide utilization of microelectromechanical systems (MEMS) in miniaturized implantable medical devices.