TSV and 3D wafer bonding technologies for advanced stacking system and application at ITRI

@article{Lo2006TSVA3,
  title={TSV and 3D wafer bonding technologies for advanced stacking system and application at ITRI},
  author={Wei-Chung Lo and Yu-Hua Chen and Cheng-Ta Ko and Ming-Ger Kao},
  journal={2009 Symposium on VLSI Technology},
  year={2006},
  pages={70-71}
}
Due to the feature of vertically chip-to-chip or chip-to-wafer stacking, the properties and characterization of through-hole vertical interconnects, microbumping, and bonding technologies will be the core competences to achieve a high reliable stacking results. ITRI mainly focuses on the investigation of the quality of low cost interconnect fabrication technology to meet the reliability requirement for 3D chip stacking interconnects. In this paper, we elucidate the interconnect technology for a… CONTINUE READING