TSV CMP processes on bonded wafers

@article{Mao2015TSVCP,
  title={TSV CMP processes on bonded wafers},
  author={Yingjun Mao and Qin Ren and Woon Leng Loh},
  journal={2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)},
  year={2015},
  pages={1-3}
}
TSV CMP processes on bonded wafers include TSV backside CMP revealing process and TSV Via last CMP process. The patterned and thinned device wafers are temporarily bonded on silicon carrier, which results in huge TTV (total thickness variation). Such TTV makes CMP processes more challenging. In this paper, CMP processes on bonded wafers are studied. Cu and… CONTINUE READING