THREE-DIMENSIONAL INTEGRATION IN MICROELECTRONICS: MOTIVATION, PROCESSING, AND THERMOMECHANICAL MODELING

@article{Cale2008THREEDIMENSIONALII,
  title={THREE-DIMENSIONAL INTEGRATION IN MICROELECTRONICS: MOTIVATION, PROCESSING, AND THERMOMECHANICAL MODELING},
  author={T. Cale and Jian-Qiang Lu and R. Gutmann},
  journal={Chemical Engineering Communications},
  year={2008},
  volume={195},
  pages={847 - 888}
}
Three-dimensional integration (3D-I) of multiple layers of active devices into a single chip is opening up opportunities for disruptive microelectronic, optoelectronic, and microelectromechanical systems. Integrated circuit (IC) designers are driving 3D-I for new products, which in turn is providing opportunities in process technology and modeling. This article reviews the status of 3D-I and describes some research opportunities for both process engineers and modeling and simulation engineers… Expand
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