System power integrity impact by package power/ground balls assignment and decoupling capacitors

@article{Lin2012SystemPI,
  title={System power integrity impact by package power/ground balls assignment and decoupling capacitors},
  author={Cheng-Hsun Lin and Chen-Chao Wang and Hung-Yu Wang},
  journal={2012 Asia-Pacific Symposium on Electromagnetic Compatibility},
  year={2012},
  pages={265-268}
}
Power integrity is one of the important issues of system design. Power and current levels are expected to increase with a corresponding to decrease in the voltage and increment of I/O number. Based on these factors, system designer faces the challenge on power delivery network. The power/ground (P/G) ball is often used as a link between the package and printed circuit board (PCB). It relates to the system power distribution from the voltage regulator module (VRM) to IC. When considering the… CONTINUE READING

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Power integrity co-analysis and design in a PCB with BGA package using transmission matrix method

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) • 2015
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