System Integration of Electronic Functions in Smart Packaging Applications

@article{Nilsson2012SystemIO,
  title={System Integration of Electronic Functions in Smart Packaging Applications},
  author={H. Nilsson and Tomas Unander and Johan Siden and H. A. Andersson and Anatoliy Manuilskiy and Magnus Hummelg{\aa}rd and Mikael Gulliksson},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year={2012},
  volume={2},
  pages={1723-1734}
}
A system integration scheme relevant for smart packaging applications is presented. Recent advances in printed electronics, radio frequency identification tag production, and standardization of communication protocols are factors that increase the design freedom for new applications. As in all new technology fields, the first products are expected to appear in the high-cost segment attracting early adopters in the form of niche products. A reasonable assumption is that these products will come… CONTINUE READING
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