Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder

@inproceedings{2011SurfaceSC,
  title={Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder},
  author={朱祥龙 and 康仁科 and 董志刚 and 冯光},
  year={2011}
}
Double-spindle triple-workstation(DSTW) ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter(≥300 mm) silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are… CONTINUE READING

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