• Corpus ID: 56087098

Surface Grinding in Silicon Wafer Manufacturing

  title={Surface Grinding in Silicon Wafer Manufacturing},
  author={Z. J. Pei},
  • Z. Pei
  • Published 2001
  • Materials Science
Silicon wafers are used for production of most microchips. Various processes are needed to transform a silicon crystal ingot into wafers. As one of such processes, surface grinding possesses the great potential of producing silicon wafers with lower cost and better quality comparing with its counterparts (lapping for wiresawn wafers and polishing for etched wafers). In order to fully utilize the potential of surface grinding, however, some technical obstacles will have to be overcome. This… 

An experimental investigation into soft-pad grinding of wire-sawn silicon wafers

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required to

Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments

A study on soft-pad grinding of 300 mm wire-sawn silicon wafers through Finite Element Analysis (FEA) with designed experiments is presented and implications of this study to manufacturing are discussed.



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