Sub-lithographic Patterning via Tilted Ion Implantation for Scaling Beyond the 7-nm Technology Node

Abstract

Tilted ion implantation (TII) can be used in conjunction with pre-existing masking features on the surface of a substrate to form features with smaller dimensions and smaller pitch. In this paper, the resolution limit of this sub-lithographic patterning approach is examined via experiments as well as Monte Carlo process simulations. TII is shown to be… (More)

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