Study on the impact of barrier metal deposition processes on W Via/CA ET high resistance by TEM failure analysis

@article{Liu2015StudyOT,
  title={Study on the impact of barrier metal deposition processes on W Via/CA ET high resistance by TEM failure analysis},
  author={Binghai Liu and Irene Tee and Seah Soo Sien and Chen Ye and Elizabeth and Zhu Jie and Eddie Er and Si Ping Zhao and Jeffery Lam},
  journal={2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits},
  year={2015},
  pages={88-91}
}
In this work we reported ET (electrical testing) failure case studies related to the process drift of barrier metal deposition (BM) during W via/CA process loops. We presented detailed TEM failure analysis in order to understand the failure mechanism and root cause behind the high via/CA resistance. We demonstrated the importance of TEM characterization and identification of key physical failure signatures for the root-cause understanding of via/CA-level ET failure, and the correlation between… CONTINUE READING