Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate

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@article{Zhao2015StudyOH, title={Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate}, author={Su-Yan Zhao and Xin Li and Yun-Hui Mei and Guo-Quan Lu}, journal={Microelectronics Reliability}, year={2015}, volume={55}, pages={2524-2531} }