Study on flip chip assembly of high density micro-LED array


Flip chip assembly technology is an attractive solution for high I/O density and fine-pitch microelectronics packaging. Recently, high efficient GaN-based light-emitting diodes (LEDs) have undergone a rapid development and flip chip bonding has been widely applied to fabricate high-brightness GaN micro-LED arrays [1]. The flip chip GaN LED has some… (More)


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