Study on Board Level Drop Reliability of Wafer Level Chip Scale Package with Leadfree Solder

@article{Xueren2008StudyOB,
  title={Study on Board Level Drop Reliability of Wafer Level Chip Scale Package with Leadfree Solder},
  author={Zhang Xueren and Zhu Wenhui and P. Edith and Tan Hien Boon},
  journal={2008 10th Electronics Packaging Technology Conference},
  year={2008},
  pages={1096-1101}
}
Wafer level chip scale package (WLCSP) is a promising packaging technology to accommodate the demand for small, portable handheld electronic. This bare-die bumped package is able to offer significant area savings, improve package electrical parasitics and power dissipation performance over substrate-based BGA packages. However, its board level reliability especially mechanical performance under shock impact is a great concern for handheld electronics. In this paper, daisy chained WLCSP packages… CONTINUE READING

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References

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Lead-free Solder Material Characterization For Themomechanical RDL

E.S.W. Poh, W. H. Zhu, X. R Zhang
Technology Conf, Nevada, May, • 2007

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