Study of thermal stress by numerical simulation method on electronic package with power chip

@article{Lei2013StudyOT,
  title={Study of thermal stress by numerical simulation method on electronic package with power chip},
  author={Wang Lei and Wang Kaikun and Li Mingrong and Zhang Xianfeng},
  journal={2013 14th International Conference on Electronic Packaging Technology},
  year={2013},
  pages={435-438}
}
According to simulation results of the temperature, thermal stress of electronic package is analyzed by thermal-mechanical sequential coupling method. The results show that higher thermal stress are located in the place around power chip when the stress neighboring the periphery of the package is lower and the maximum thermal stress locates at the contact… CONTINUE READING