Study of the Distorted Layer Structure of Silicon Wafers by the Method of Plasma-chemical Etching after Mechanical Machining Processes


In this experimental work, by using the method of plasma-chemical etching, we have dealt with the causes of the creation of a distorted layer on the surface of silicon wafers during mechanical machining processes, in addition, the elucidation of connections between the structure of this layer and characteristic parameters of the mechanical strength of these… (More)


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