Study of polyimide coated chip and mold compound adhesion

@article{Asmah2016StudyOP,
  title={Study of polyimide coated chip and mold compound adhesion},
  author={M. T. Asmah},
  journal={2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference},
  year={2016},
  pages={1-4}
}
  • M. T. Asmah
  • Published 2016 in
    2016 IEEE 37th International Electronics…
This study investigates the adhesion strength between polyi-mide coated chip and epoxy mold compound (EMC). Polyi-mide is an important material to reduce chip stress and protect the mobility ions from EMC to the chip circuitry that can lead to an electrical failure. However, there was a delamination issue between encapsulation material and polyimide during… CONTINUE READING