Study of package warp behavior for high-performance flip-chip BGA

@article{Sawada2003StudyOP,
  title={Study of package warp behavior for high-performance flip-chip BGA},
  author={Yuko Sawada and Kozo Harada and Hirofumi Fujioka},
  journal={Microelectronics Reliability},
  year={2003},
  volume={43},
  pages={465-471}
}
To meet the future needs of high pin count and high performance, the LSI die and package size of flip-chip BGA (FC-BGA) devices have become larger. As a result, package warpage due to mismatch of the coefficients of thermal expansion among the construction materials has become a more serious problem for package reliability. In this paper, package warpage is successfully measured by a 3-D surface profile method in the temperature range from )55 to 230 C. Furthermore, the package warpage of FC… CONTINUE READING
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