Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile

Abstract

Article history: Received 11 November 2011 Received in revised form 23 April 2012 Accepted 12 August 2012 Available online 8 September 2012 0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.08.006 ⇑ Corresponding author. E-mail addresses: Raymond_Wang@aseglobal.com (T.H. Wang). Package warpage is an important factor… (More)
DOI: 10.1016/j.microrel.2012.08.006

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