Studies on the reliability of power packages based on strength and fracture criteria

Abstract

Thermal cycling induced failure in power packages has been studied comparing thermal cycling (TC) with thermal shock (TS) tests by thermo-mechanical analyses. The major question for the time reduction is that after the failure mechanism and if it changes with changed loading type and duration. These questions were addressed by theoretical analyses including… (More)
DOI: 10.1016/j.microrel.2012.03.018

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Cite this paper

@article{Dudek2011StudiesOT, title={Studies on the reliability of power packages based on strength and fracture criteria}, author={Rainer Dudek and Reinhard Pufall and Bettina Seiler and Bernd Michel}, journal={2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems}, year={2011}, pages={1/8-8/8} }