Structure and Morphology of Fluorocarbon Films Grown by Hot Filament Chemical Vapor Deposition

@article{Lau2000StructureAM,
  title={Structure and Morphology of Fluorocarbon Films Grown by Hot Filament Chemical Vapor Deposition},
  author={Kenneth K. S. Lau and Jeffrey A. Caulfield and Karen K. Gleason},
  journal={Chemistry of Materials},
  year={2000},
  volume={12},
  pages={3032-3037}
}
Hexafluoropropylene oxide (HFPO) flow rate and filament preconditioning time were found to strongly influence the structure and morphology of fluorocarbon films grown by hot filament chemical vapor deposition (HFCVD). The four films discussed in this work all exhibited the vibrational frequencies of linear CF2 chains, which are also characteristic of bulk poly(tetrafluoroethylene) (PTFE), as shown through Fourier transform infrared spectroscopy (FTIR). The films also incorporated hydroxyl (OH… 

Figures and Tables from this paper

Thermal chemical vapor deposition of fluorocarbon polymer thin films in a hot filament reactor
Abstract Formation of fluorocarbon polymer films with a linear (CF 2 –CF 2 ) n molecular structure similar to polytetrafluoroethylene, PTFE is described by a hot filament chemical vapor deposition
Deposition features and wettability behavior of fluoropolymer coatings from hexafluoropropylene oxide activated by NiCr wire
Abstract The paper presents the results of the Hot-Wire Chemical Vapor Deposition of fluoropolymer films from C3F6O precursor gas, activated by NiCr wire catalyst mesh, at varying deposition process
Fluorocarbon thin film with superhydrophobic property prepared by pyrolysis of hexafluoropropylene oxide
Abstract A fluorocarbon thin film with superhydrophobic property was prepared by chemical vapor deposition (CVD) method at low temperature (200–300 °C) via pyrolysis hexafluoropropylene oxide (HFPO).
Surface modification of materials by dielectric barrier discharge deposition of fluorocarbon films
Abstract Dielectric barrier discharges have been used to deposit fluorocarbon (FC) films on various materials, such as paper, glass, and silicon substrates. The primary monomers used for plasma
Hot-Filament Chemical Vapor Deposition of Organosilicon Thin Films from Hexamethylcyclotrisiloxane and Octamethylcyclotetrasiloxane
A nonplasma technique, hot-filament chemical vapor deposition (HFCVD), is an alternative method for producing organosilicon films of novel structure. Films are deposited onto room-temperature
Thermal properties of poly(neopentylmethacrylate) thin films deposited via solventless, radical initiated chemical vapor deposition
Abstract This paper investigates the thermal properties of thin films of poly(neopentylmethacrylate) (PnPMA) deposited via solventless, radical initiated chemical vapor deposition (iCVD). The effects
Ferroelectric poly(vinylidene fluoride) thin films grown by low-pressure chemical vapor polymerization
Ferroelectric poly(vinylidene fluoride) polymer (VDF 2 ) n thin-film formation by a low-pressure chemical vapor polymerization (CVP) process is described. The process involves polymerization of an
Surface morphology and structural analysis of fluorocarbon nano-rings formation through EBL and SiO2 plasma etching
Abstract This paper reports the formation of nano-scale ring-shaped fluorocarbon macromolecules during silicon dioxide SiO 2 reactive ion etching (RIE). This nanostructure was created on a SiO 2
Relationship of CF2 concentration to deposition rates in the pyrolytic chemical vapor deposition process
Polytetrafluoroethylene films have been deposited for use as low dielectric constant materials in microelectronic chips. Deposition is performed through pyrolysis of hexafluoropropylene oxide on a
Plasma enhanced CVD of fluorocarbon films by low-pressure dielectric barrier discharge
Abstract Low-pressure dielectric barrier discharge (DBD) plasmas have been used to deposit polymerized fluorocarbon (FC) films on silicon substrates. The effects of discharge pressure and frequency
...
1
2
3
4
5
...