Structural RFIC device testing through built-in thermal monitoring

@article{Altet2003StructuralRD,
  title={Structural RFIC device testing through built-in thermal monitoring},
  author={Josep Altet and Antonio J. Rubio and Jos{\'e} Luis Rossell{\'o} and Jaume C. Segura},
  journal={IEEE Communications Magazine},
  year={2003},
  volume={41},
  pages={98-104}
}
Current RFIC test practices perform systemlevel verification through specific functional validation. Structural testing, although widely accepted for digital and analog generic ICs, is not adopted in this domain due to the lack of appropriate fault models. Another important reason is the impossibility of embedding testmode circuitry within the RF blocks… CONTINUE READING