Stress evaluation of flip chip bonding die by thermal compression bonding using Raman spectroscopy

We evaluated the residual stress of the Si die which bonding to organic substrate by the flip chip technology, using Raman spectroscopy. Non-conductive paste (NCP) and non-conductive film (NCF) are used for the high-density flip chip joint as pre applied underfill. Then, it was understand that a physical characteristic of NCF influenced the residual stress… (More)