Stress and microstructure evolution in thick sputtered films

@inproceedings{Detor2009StressAM,
  title={Stress and microstructure evolution in thick sputtered films},
  author={Andrew J. Detor and Andrea M. Hodge and Eric Chason and Yinmin Wang and Hongwei Xu and Mark K. Conyers and Abbas Nikroo and Alex V. Hamza},
  year={2009}
}
Materials synthesized by deposition techniques are often plagued by high levels of residual stress. While the origin and control of this stress in thin (sub-micron) films has been an active area of research, it is not clear how the results extrapolate with thickness. In the present work, in situ residual stress measurements are performed during the sputter deposition of beryllium, spanning the transition from thin to thick. Variables including sputtering gas pressure and substrate biasing are… CONTINUE READING

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