Stress analysis of spontaneous Sn whisker growth

@article{Tu2006StressAO,
  title={Stress analysis of spontaneous Sn whisker growth},
  author={Kai-jia Tu and Changpin Chen and Albert T. Wu},
  journal={Journal of Materials Science: Materials in Electronics},
  year={2006},
  volume={18},
  pages={269-281}
}
Spontaneous Sn whisker growth is a surface relief phenomenon of creep, driven by a compressive stress gradient. No externally applied stress is required for the growth, and the compressive stress is generated within, from the chemical reaction between Sn and Cu to form the intermetallic compound Cu6Sn5 at room temperature. To obtain the compressive stress gradient, a break of the protective oxide on the Sn surface is required because the free surface of the break is stress-free. Thus… CONTINUE READING
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