Stress-Compensating MEMS Sensor Assembly

@article{Etschmaier2017StressCompensatingMS,
  title={Stress-Compensating MEMS Sensor Assembly},
  author={Harald Etschmaier and Anderson Pires Singulani and Coen Tak and Kai Zoschke and Danny Jaeger and Hermann Opperman},
  journal={2017 IEEE 67th Electronic Components and Technology Conference (ECTC)},
  year={2017},
  pages={932-936}
}
In this work, a system assembly technology will be presented that allows an effective mechanical decoupling of the MEMS element from the environment while maintaining minimal package footprint and cost. It utilizes a Si interposer with planar spring structures for an independent suspension of all interconnects to the MEMS element. The design of the planar springs was optimized for maximum stability and effectiveness using finite element analysis. The MEMS die is arranged below the interposer… CONTINUE READING

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