Strain Measurements of Silicon Dioxide Microspecimens by Digital Imaging Processing

  title={Strain Measurements of Silicon Dioxide Microspecimens by Digital Imaging Processing},
  author={William N. Sharpe and J. S. Pulskamp and Daniel S Gianola and Chris Eberl and Ronald Polcawich and Robert J Thompson},
Silicon dioxide thin film is a common component in electronic devices and in MEMS, but its mechanical properties have rarely been studied. Techniques have been adapted and developed to conduct tensile tests on 1.0 μm thick silicon dioxide specimens that are 100, 150, and 200 μm wide and either 1 or 2 mm long. One end of the specimen remains fastened to the substrate, and the other is glued to a silicon carbide fiber attached to a 30 g load cell mounted on a piezoelectric translation stage… CONTINUE READING
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