Stochastic Interconnect Modeling, Power Trends, and Performance Characterization of 3-D Circuits

Abstract

Three-dimensional (3-D) technology promises higher integration density and lower interconnection complexity and delay. At present, however, not much work on circuit applications has been done due to lack of insight into 3-D circuit architecture and performance. One of the purposes of realizing 3-D integration is to reduce the interconnect complexity and… (More)

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