Stencil evaluation of ultra fine pitch solder paste printing process

@article{Yang2010StencilEO,
  title={Stencil evaluation of ultra fine pitch solder paste printing process},
  author={Jimmy Jun-Min Yang and Jay Cy Huang and Vincent G. B. Lee and Jojo Tsai and Jingfeng Ku and Kwi Chol Li and Ander Hsieh and Thomas R. Verhoeven},
  journal={2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference},
  year={2010},
  pages={1-4}
}
For the ultra fine pitch applications, solder paste printing acts as one of the most critical step in the SMT assembly process. A review of literature indicates that solder paste printing contributes around 60% of the total process defects. One of the key factors for the performance of solder paste deposition is stencil fabrication quality. Other important factors include stencil aperture design, paste printing parameters and stainless steel raw material. The incoming inspection of the stencil… CONTINUE READING

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