Statistical interconnect metrics for physical-design optimization

  title={Statistical interconnect metrics for physical-design optimization},
  author={Kanak Agarwal and Mridul Agarwal and Dennis Sylvester and David Blaauw},
  journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems},
In this paper, statistical models for the efficient analysis of interconnect delay and crosstalk noise in the presence of back-end process variations are developed. The proposed models enable closed-form computation of means and variances of interconnect-delay, crosstalk-noise peak, and coupling-induced-delay change for given magnitudes of variation in relevant process parameters, such as linewidth, metal thickness, metal spacing, and interlayer dielectric (ILD) thickness. The proposed approach… CONTINUE READING
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