Statistical Thermal Profile Considering Process Variations: Analysis and Applications

@article{Jaffari2008StatisticalTP,
  title={Statistical Thermal Profile Considering Process Variations: Analysis and Applications},
  author={Javid Jaffari and Mohab Anis},
  journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems},
  year={2008},
  volume={27},
  pages={1027-1040}
}
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultra-deep submicrometer designs. To correctly predict performance/ leakage/reliability measures and address any yield losses during the early stages of design phases, it is desirable to have a reliable thermal estimation of the chip. However, the leakage power sources vary greatly due to process variations and temperature, which result in significant variations in the hotspot and thermal… CONTINUE READING
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