State-of-the-art and trends in 3D IC/Si integrations and WLP

@article{Lau2010StateoftheartAT,
  title={State-of-the-art and trends in 3D IC/Si integrations and WLP},
  author={John H. Lau},
  journal={2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)},
  year={2010},
  pages={1-3}
}
  • John H. Lau
  • Published 2010 in
    2010 34th IEEE/CPMT International Electronic…
Moore's law has been the most powerful driver for the development of the microelectronic industry. This law emphasizes on lithography scaling and integration (in 2D) of all functions on a single chip, perhaps through system-on-chip (SoC). On the other hand, the integration of all these functions can be achieved through system-in-package (SiP) or, ultimately… CONTINUE READING