Stacking of ultra-thin film packages

@article{Ko2008StackingOU,
  title={Stacking of ultra-thin film packages},
  author={Cheng-Ta Ko and Ying-Ching Shih and Jing-Yao Chang and T. Y. Kuo and Yu-Hua Chen and Andreas Ostmann and Dion Manessis},
  journal={2008 2nd Electronics System-Integration Technology Conference},
  year={2008},
  pages={125-130}
}
This paper brings into light a new ultra-thin and highly flexible package with embedded active chips. In this technology, no supporting and permanent substrates were needed. Copper foil was used as temporal substrate, and it became the bottom circuit after patterning and etching processes. Ultra-thin chips with 20~25 mum thickness were assembled directly on… CONTINUE READING