Spin-on-glass (SOG) process-induced tungsten residue in a semiconductor manufacturing procedure

Abstract

In this article, a case of Spin-on-Glass (SOG) process-induced tungsten residue was reported. The case was found after the tungsten etchback process of filling vias. A possible failure mechanism was proposed. Based on the review of our process flow, it is believed that the tungsten residue might result from the hydrodynamic effects of SOG. q 2004 Elsevier… (More)
DOI: 10.1016/j.mejo.2004.06.021

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