Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations

@inproceedings{Luoa2005SolidstateRB,
  title={Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations},
  author={W. C. Luoa and Chia-hua Hoa and J. Y. Tsaia and Yuh Ling Lin and C. R. Kaoa},
  year={2005}
}
It had been reported that, during the reflow of the Sn–Ag–Cu solders over the Ni-bearing surface finishes, a slight variation in Cu concentration produced different reaction products at the interface. In this study, we extended our earlier efforts to investigate whether this strong Cu concentration dependency also existed for the solid-state aging reaction between the Sn–Ag–Cu solders and Ni. Specifically, five Sn–3.9Ag–xCu solders ( x= 0.2, 0.4, 0.5, 0.6, and 0.8) were reacted with Ni at 180… CONTINUE READING

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