Soldering profile optimization for vapour phase reflow technology

@article{Geczy2011SolderingPO,
  title={Soldering profile optimization for vapour phase reflow technology},
  author={Attila Geczy and Peter Szoke and Zsolt Illyefalvi-Vit{\'e}z and Mikl{\'o}s Ruszink{\'o} and Radu Bunea},
  journal={2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)},
  year={2011},
  pages={149-152}
}
Vapour Phase Soldering (VPS) is an alternative method for widespread reflow soldering technologies (e.g. infrared or convection type). VPS has emerged in the last few years after the introduction of Galden fluid. The vapour of Galden is used as the heat transfer medium. The main advantages of VPS are the lower peak temperature, nitrogen/oxygen-free inert atmosphere, the improvement in solder wetting and the reduction of the profiling time [1]. One disadvantage of VPS is the non-controllable… CONTINUE READING
8 Extracted Citations
9 Extracted References
Similar Papers

Citing Papers

Publications influenced by this paper.
Showing 1-8 of 8 extracted citations

Referenced Papers

Publications referenced by this paper.
Showing 1-9 of 9 references

Today‟s Vapour Phase Soldering – An Optimized Reflow Technology for Lead Free Soldering

  • Helmut Leicht, Andreas Thumm
  • SMTAI Conference,
  • 2008
Highly Influential
6 Excerpts

Vapour Phase Reflow - Profiling for Lead Free Alloys...

  • Allen Duck, Claus Zabel
  • SMTA International Conference,
  • 2010
1 Excerpt

Filor, "Secure Lead-Free Processes

  • Claus Zabel, Uwe
  • Elektronik Produktion & Prüftechnik, ASSCON GmbH…
  • 2007
1 Excerpt

Vapour phase for lead-free reflow" Global SMT & Packaging

  • David Suihkonen
  • 2007
2 Excerpts

Getting the Vapors

  • J. Sprovieri
  • SMT Magazine, February
  • 2002
1 Excerpt

Die Technology des „Löten in der Dampfphase“, Fluorinert - Nachrichten 3/1981

  • G. M. Wenger, R. L. Mahajan
  • 1981
1 Excerpt

Method for Soldering, Fusing or Bracing

  • R. C. Pfahl, H. H. Ammann
  • US Patent 3,866,307;
  • 1975
1 Excerpt

Similar Papers

Loading similar papers…