Soldering profile optimization for vapour phase reflow technology

  title={Soldering profile optimization for vapour phase reflow technology},
  author={Attila Geczy and Peter Szoke and Zsolt Illyefalvi-Vit{\'e}z and Mikl{\'o}s Ruszink{\'o} and Radu Bunea},
  journal={2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)},
Vapour Phase Soldering (VPS) is an alternative method for widespread reflow soldering technologies (e.g. infrared or convection type). VPS has emerged in the last few years after the introduction of Galden fluid. The vapour of Galden is used as the heat transfer medium. The main advantages of VPS are the lower peak temperature, nitrogen/oxygen-free inert atmosphere, the improvement in solder wetting and the reduction of the profiling time [1]. One disadvantage of VPS is the non-controllable… CONTINUE READING
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