Solderability testing of microcircuits

  title={Solderability testing of microcircuits},
  author={R. Oehme and G. Schaefer and R. Ward and L. Zakraysek},
  • R. Oehme, G. Schaefer, +1 author L. Zakraysek
  • Published 1977
  • Materials Science
  • Abstract : Solderability tests were performed on Fe-Ni-Co and Fe-Ni microelectronic lead base materials with surface preparations as required by MIL-M-38510C. Test samples were used from four different sources. The solderability tests included MIL-STD-883A, Meniscograph and Hot Iron methods. Sample data from the three test methods showed good correlation. Microelectronic lead aging studies showed that the current steam aging environment should be retained. (Author) 
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