Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

@inproceedings{Jang1999SolderRC,
  title={Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology},
  author={Jin-wook Jang and Pil Gu Kim and K. N. Tu and D. R. Frear and P. A. Thompson},
  year={1999}
}
Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in the Si/SiO2/Al/Ni–P/63Sn–37Pb multilayer structure was analyzed using transmission electron microscopy, scanning electron microscopy, energy dispersive x-ray, and electron probe microanalyzer. The electroless Ni–P had an amorphous structure and a composition of Ni85P15 in the as-plated condition. Upon reflow, the electroless Ni–P transformed to Ni3Sn4 and Ni3P. The crystallization of electroless Ni–P to… CONTINUE READING

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