Solder joint structure and reliability of board level BGA package using no-clean curable solder paste

Abstract

In the SMT(surface mount technology) process, the cleaning process of flux residue is getting difficult due to the decrease of interconnection pitch. In this study, the curable type no-clean solder paste containing resin instead of rosin was formulated and its effectiveness on the reflow process accessibility and the thermal cycling and dynamic bending… (More)

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