Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials

@article{Zahn2003SolderJF,
  title={Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials},
  author={Bret A. Zahn},
  journal={53rd Electronic Components and Technology Conference, 2003. Proceedings.},
  year={2003},
  pages={83-94}
}
  • B. Zahn
  • Published 27 May 2003
  • Materials Science
  • 53rd Electronic Components and Technology Conference, 2003. Proceedings.

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