Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials

  title={Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials},
  author={Bret A. Zahn},
  journal={53rd Electronic Components and Technology Conference, 2003. Proceedings.},
  • B. Zahn
  • Published 27 May 2003
  • Materials Science
  • 53rd Electronic Components and Technology Conference, 2003. Proceedings.

Figures and Tables from this paper

Effect of integrated heat spreader on thermal performance and bump joint reliability for flip chip packages
  • R. Mandal, Y. Mui, Zhang Hengyun
  • Engineering
    2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
  • 2008
Thermal simulation had been conducted on flip chip packages with copper heat spreader and better thermal performance was achieved. The copper heat spreader was able to enhance the heat spreading from
Feature extraction and damage-precursors for prognostication of lead-free electronics
Damage mechanics of solder/IMC interface fracture in Pb-free solder interconnects
This study addresses the mechanics of the relatively brittle solder/intermetallic (IMC) interface fracture process using damage mechanics concept. The damage state, ϕ of a material point in the
Thermomechanical Reliability Study of Flip Chip Solder Bumps: Using Laser Ultrasound Technique and Finite Element Method
  • Jin Yang, I. C. Ume
  • Materials Science, Engineering
    IEEE Transactions on Advanced Packaging
  • 2008
Current techniques for nondestructive quality evaluation of solder bumps in electronic packages are either incapable of detecting solder bump cracks, or unsuitable for in-line inspection due to high
Review of Methodologies for Structural Integrity Evaluation of Power Modules
The distributed state concept (DSC) approaches based on the unified constitutive modeling and the unified mechanics theory are promising for evaluating the structural integrity of power modules.
Failure prediction of the solder joints in the ball-grid-array package under thermal loading
This paper studies the numerical failure mechanism of the solder joints in the ball grid array (BGA) package under thermal reliability process. The package consists of the silicon die, the Flame
A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since
Numerical Simulation of the Junction Temperature, the Coolant Flow Rate and the reliability of an IGBT Module
By increasing coolant flow rate, the junction temperature of IGBT power modules can be reduced but this is accompanied by undesirable increase in pressure and pumping power. In this paper, numerical
Comparison of FEA Modeling Techniques for Plastic Ball Grid Array Assemblies
  • Chienchih Chen, J. Suhling, P. Lall
  • Engineering
    2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
  • 2018
The reliability study of solder joints is one of the primary issues in lead free electronic assemblies, and life testing of electronic assemblies is often performed using time consuming thermal


Fatigue of solder joints in surface mount devices
Lifetime studies of a 16 I/O surface-mounted solder joint array undergoing isothermal cyclic fatigue in torsion shear under fixed plastic strain range show a strong correlation with creep fatigue and
Effect of simulation methodology on solder joint crack growth correlation
  • R. Darveaux
  • Physics
    2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
  • 2000
A generalized solder joint fatigue life model for surface mount packages was previously published by the author. The model is based on correlation to measured crack growth data on BGA joints during
A fracture mechanics approach to soldered joint cracking
Fracturing of a soldered joint, 60Sn-40Pb and beryllium copper, is investigated by a method that makes use of a double cantilever beam specimen where two symmetrical beams are soldered together. In
Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy
  • A. Syed
  • Engineering
    2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
  • 2001
Solder joint reliability has received a renewed interest since the inception of BGA and CSP type packages. While traditionally board level reliability during thermal and power cycling is considered
A comprehensive surface mount reliability model (CSMR) covering several generations of packaging and assembly technology
An extensive set of surface mount reliability data gathered by several AT&T organizations between 1984 and 1992 has been integrated in a single design-for-reliability tool, AT&T's Comprehensive
Time-independent plastic behaviour of solders and its effect on FEM simulations for electronics packages
  • S. Wiese, S. Rzepka, E. Meusel
  • Engineering
    2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617)
  • 2002
The time-independent behaviour of SnPb37, SnAg3.5 and SnAg4Cu0.5 has been investigated on flip chip solder joints. The test specimen consisted of two silicon chips (3.3 mm in square) bonded by 4 flip
A fracture mechanics approach to thermal fatigue life prediction of solder joints
A life prediction approach for solder joints under thermal fatigue, based on fracture mechanics and assuming that the thermal fatigue crack propagation in solder joints is primarily controlled by the
Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach
A model is developed which predicts the creep damage accumulation in solder joints during temperature cycling. The model relates the crack growth rate to the rate of creep energy density dissipated