Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects

@article{Li2011SolderVE,
  title={Solder Volume Effects on the Microstructure Evolution
and Shear Fracture Behavior of Ball Grid Array Structure
Sn-3.0Ag-0.5Cu Solder Interconnects},
  author={Xun-Ping Li and Jian-Min Xia and Min-bo Zhou and Xiaoqian Ma and Xin-Ping Zhang},
  journal={Journal of Electronic Materials},
  year={2011},
  volume={40},
  pages={2425-2435}
}
The standoff height of ball grid array (BGA) structure solder joints has a significant influence on the formation and growth of interfacial intermetallic compounds (IMC). The results show that the thickness of the IMC layer at the solder/Cu interface of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints increases with decreasing standoff height after reflowing. The growth behavior of the total IMC layer is controlled by a diffusion process with the growth rate increasing with standoff height. Both the… CONTINUE READING

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