Solder-Joint Quantitative Crack Analysis—Ohmic Resistance Approach

  title={Solder-Joint Quantitative Crack Analysis—Ohmic Resistance Approach},
  author={I. Gershman and J. B. Bernstein},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
This paper presents a novel technique in the area of solder-joint reliability testing, suggesting a new approach for efficient testing of new products. An analytical model was developed relating the solder-joint ohmic resistance and the joint crack's length caused by temperature cycles. Based on the analytical model, a technique was developed allowing the measurement of a solder-joint's crack length in a nondestructive, continuous way. Thus, prediction of the solder-joint's end-of-life could be… CONTINUE READING
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