Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability

In this paper, a thermosonic flip-chip bonding process using lateral ultrasonic vibration is proposed. To enhance the reliability of the specimen after the lateral thermosonic process, a sliding mechanism is adopted with investigation of equivalent stiffness of the anisotropic conductive film (ACF) joint. By a tensile test, it is shown that the equivalent… CONTINUE READING