Size Effect of AlN on the Performance of Printed Circuit Board (PCB) Material-brominated Epoxy Resin

@inproceedings{Yung2006SizeEO,
  title={Size Effect of AlN on the Performance of Printed Circuit Board (PCB) Material-brominated Epoxy Resin},
  author={K. C. Yung and J. Wu and Tai M. Yue and Changsheng Xie},
  year={2006}
}
Many properties of brominated epoxy resin, a type of material widely used in printed circuit boards (PCBs), such as the coefficient of thermal expansion (CTE) (pre and post Tg), dielectric constant (Dk), dissipation factor (Df), tensile strength, and Young’s modulus, have been evaluated according to size and content in terms of the weight of the aluminum nitride (AlN) filler. It has been found that the performance of epoxy resin improves significantly when AlN is used as the filler. Excellent… CONTINUE READING