Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry

Abstract

The sum of chemical and mechanical bonding limits the adhesive strength of die-attach and substrate-attach layers. This is also true for sintered silver joints whose development and employment are underway in the electronic packaging community. Chemical bonding is dictated by numerous parameters associated with the compatibility of the metallurgical bond of… (More)

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Cite this paper

@article{Wereszczak2012SinteredSJ, title={Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry}, author={A. A. Wereszczak and Danilo Vuono and Zhenxian Liang and E. E. Fox}, journal={2012 7th International Conference on Integrated Power Electronics Systems (CIPS)}, year={2012}, pages={1-6} }