Single/few-layer boron nitride-based nanocomposites for high thermal conductivity underfills

@article{Lin2012SinglefewlayerBN,
  title={Single/few-layer boron nitride-based nanocomposites for high thermal conductivity underfills},
  author={Ziyin Lin and Yagang Yao and A. Mcnamara and Kyoung-sik Moon and C. P. Wong},
  journal={2012 IEEE 62nd Electronic Components and Technology Conference},
  year={2012},
  pages={1437-1441}
}
Thermal management in 3D packaging plays an important role in the device performance and reliability. The development of thermally conductive underfills is highly crucial, but still challenging. In this work, single/few-layer boron nitride (BN) was exfoliated from bulk h-BN flakes and was incorporated into epoxy resin via a solvent transfer method. [1] The structure of exfoliated BN was characterized by varieties of techniques, including scanning electron microscopy, transmission electron… CONTINUE READING

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In this work , single / few - layer boron nitride ( BN ) was exfoliated from bulk h - BN flakes and was incorporated into epoxy resin via a solvent transfer method . [ 1 ] The structure of exfoliated BN was characterized by varieties of techniques , including scanning electron microscopy , transmission electron microscopy , electron diffraction , Raman microscopy , and UV - vis microscopy .
In this work , single / few - layer boron nitride ( BN ) was exfoliated from bulk h - BN flakes and was incorporated into epoxy resin via a solvent transfer method . [ 1 ] The structure of exfoliated BN was characterized by varieties of techniques , including scanning electron microscopy , transmission electron microscopy , electron diffraction , Raman microscopy , and UV - vis microscopy .
In this work , single / few - layer boron nitride ( BN ) was exfoliated from bulk h - BN flakes and was incorporated into epoxy resin via a solvent transfer method . [ 1 ] The structure of exfoliated BN was characterized by varieties of techniques , including scanning electron microscopy , transmission electron microscopy , electron diffraction , Raman microscopy , and UV - vis microscopy .
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