Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

@article{Macurova2014SimulationOS,
  title={Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards},
  author={Katerina Macurova and Paul Angerer and Ronald Schox0308ngrundner and Thomas Krivec and Mike Morianz and Thomas Antretter and Ra{\'u}l Acosta Bermejo and Martin Pletz and M. Brizoux and Wilson Maia},
  journal={2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)},
  year={2014},
  pages={1-7}
}
The knowledge of thermally induced strains created during the assembly in Printed Circuit Boards (PCB) is an important issue for electronic packages. In the assembly process, a thin silicon-chip is attached onto a copper foil. The curing of the adhesive is followed by the cooling down of the assembled structure to room temperature. The different properties of the involved materials and the geometry of the structure induce stresses and deflection in the substrate, which can become critical for… CONTINUE READING